[IEEE 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2015.5.26-2015.5.29)] 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - Thermal modeling and experimental study of 3D stack package with hot spot consideration
Nakamura, Naoaki, Iwakiri, Yoshihisa, Onuki, Hiroshi, Suwada, Makoto, Kikuchi, ShunichiYear:
2015
Language:
english
DOI:
10.1109/ectc.2015.7159833
File:
PDF, 1.65 MB
english, 2015