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[IEEE 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2015.5.26-2015.5.29)] 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - Reliability assessment of thermally compression bonded copper pillar on organic and ceramic substrates
Bhattacharya, Swapan K., Lewis, Brian, Wu, Han, Hodge, Kelley, Xie, Fei, Pathammavong, Keck, Houston, Paul N., Baldwin, Daniel F.Year:
2015
Language:
english
DOI:
10.1109/ectc.2015.7159889
File:
PDF, 1.27 MB
english, 2015