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[IEEE 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2015.5.26-2015.5.29)] 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - Low temperature, low pressure CMOS compatible Cu -Cu thermo-compression bonding with Ti passivation for 3D IC integration
Panigrahi, Asisa Kumar, Bonam, Satish, Ghosh, Tamal, Vanjari, Siva Rama Krishna, Singh, Shiv GovindYear:
2015
Language:
english
DOI:
10.1109/ectc.2015.7159909
File:
PDF, 1.17 MB
english, 2015