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[IEEE 2015 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo) - Edinburgh, United Kingdom (2015.11.10-2015.11.13)] 2015 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo) - Shielding structures for through silicon via (TSV) to active circuit noise coupling in 3D IC
Lim, Jaemin, Lee, Manho, Jung, Daniel H., Kim, Jonghoon J., Choi, Sumin, Lee, Hyunsuk, Kim, JounghoYear:
2015
Language:
english
DOI:
10.1109/emccompo.2015.7358366
File:
PDF, 506 KB
english, 2015