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[IEEE 2005 7th Electronic Packaging Technology Conference - Singapore (07-09 Dec. 2005)] 2005 7th Electronic Packaging Technology Conference - Drop Impact Life Prediction Models with Solder Joint Failure Modes and Mechanisms
Jing-en Luan,, Tong Yan Tee,, Xueren Zhang,, Hussa, E., Wang, J., Ford, C., Jen, K.C.Volume:
1
Year:
2005
Language:
english
DOI:
10.1109/eptc.2005.1614369
File:
PDF, 7.79 MB
english, 2005