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[IEEE 7th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis - Enschede, The Netherlands (8-11 October 1996)] Proceedings of the 7th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis - Study of the microstructure of IC interconnect metallisations using analytical transmission electron microscopy and secondary ion mass spectrometry
Cosemans, P., D'Olieslaeger, M., de Ceuninck, W., de Schepper, L., Stals, L.Year:
1996
Language:
english
DOI:
10.1109/esref.1996.888195
File:
PDF, 346 KB
english, 1996