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[IEEE 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2015.10.21-2015.10.23)] 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - A new reliable adhesion enhancement process for directly plating on molding compounds for package level EMI shielding
Mukai, Kenichiroh, Magaya, Tafadzwa, Eastep, Brian, Kim, Kwonil, Gaherty, Lee, Kashyap, AnirudhYear:
2015
Language:
english
DOI:
10.1109/impact.2015.7365254
File:
PDF, 1.05 MB
english, 2015