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[IEEE 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2015.10.21-2015.10.23)] 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - CIRCUPOSIT™ 6530 catalyst process for electroless copper metallization
Feng Liu,, Milum, Kristen, Cleary, Don, Rzeznik, Maria, Zhou, Wenjia, Kwong, Connie S. K., Chan, Dennis C. Y., Chum, Vini S. W., Li, Crystal P. L., Yee, Dennis K. W., Chang, Jerry, Yoshida, KatsuhiroYear:
2015
Language:
english
DOI:
10.1109/impact.2015.7365255
File:
PDF, 1.48 MB
english, 2015