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Elastic modulus variation due to moisture absorption and permanent changes upon redrying in an epoxy based underfill
Ferguson, T.P., Jianmin Qu,Volume:
29
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/tcapt.2005.853172
Date:
March, 2006
File:
PDF, 220 KB
english, 2006