Elastic modulus variation due to moisture absorption and...

Elastic modulus variation due to moisture absorption and permanent changes upon redrying in an epoxy based underfill

Ferguson, T.P., Jianmin Qu,
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Volume:
29
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/tcapt.2005.853172
Date:
March, 2006
File:
PDF, 220 KB
english, 2006
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