[IEEE 2014 22nd Telecommunications Forum Telfor (TELFOR) - Belgrade, Serbia (2014.11.25-2014.11.27)] 2014 22nd Telecommunications Forum Telfor (TELFOR) - Structure of Ball Grid Array/Permanent semi-elastomeric thermally conductive crumb rubber reinforced bituminous Stencil/Printed Circuit Board interconnects
Karydopoulos, P., Frantzis, P., Karagiannis, N.Year:
2014
Language:
english
DOI:
10.1109/telfor.2014.7034493
File:
PDF, 937 KB
english, 2014