Void Defect Reduction after Chemical Mechanical Planarization of Trenches Filled by Direct/Pulse Plating
Lin, Jeng-Yu, Wan, Chi-Chao, Wang, Yung-Yun, Feng, Hsien-PingVolume:
154
Year:
2007
Language:
english
Journal:
Journal of The Electrochemical Society
DOI:
10.1149/1.2409869
File:
PDF, 616 KB
english, 2007