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[IEEE 2011 IEEE International 3D Systems Integration Conference (3DIC) - Osaka (2012.01.31-2012.02.2)] 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International - 3D integration demonstration of a wireless product with design partitioning
Druais, G., Ancey, P., Aumont, C., Caubet, V., Chapelon, L-L, Chaton, C., Cheramy, S., Cordova, S., Cirot, E., Colonna, J-P, Coudrain, P., Divel, T., Dodo, Y., Farcy, A., Guitard, N., Haxaire, K., HotYear:
2012
Language:
english
DOI:
10.1109/3dic.2012.6262962
File:
PDF, 449 KB
english, 2012