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[IEEE 2015 16th International Conference on Electronic Packaging Technology (ICEPT) - Changsha, China (2015.8.11-2015.8.14)] 2015 16th International Conference on Electronic Packaging Technology (ICEPT) - Morphological evolution and migration behavior of the microvoid in Sn/Cu interconnects under electrical field studied by phase-field simulation
Liang, Shui-Bao, Ke, Chang-Bo, Zhou, Min-Bo, Zhang, Xin-PingYear:
2015
Language:
english
DOI:
10.1109/icept.2015.7236589
File:
PDF, 1.36 MB
english, 2015