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[IEEE 2015 16th International Conference on Electronic Packaging Technology (ICEPT) - Changsha, China (2015.8.11-2015.8.14)] 2015 16th International Conference on Electronic Packaging Technology (ICEPT) - Design and fabrication of a silicon microvalve for large flow application
Li, Yongjun, Deng, Ning, Huang, Xian, Zhang, ShengchangYear:
2015
Language:
english
DOI:
10.1109/icept.2015.7236802
File:
PDF, 1.35 MB
english, 2015