![](/img/cover-not-exists.png)
[IEEE 2009 International Conference on Measuring Technology and Mechatronics Automation - Zhangjiajie, Hunan, China (2009.04.11-2009.04.12)] 2009 International Conference on Measuring Technology and Mechatronics Automation - Delamination in Thermohyperelastic Plastic IC Packaging Material Due to Thermal Load and Moisture
Li, Zhigang, Yang, Xuexia, Shu, XuefengYear:
2009
Language:
english
DOI:
10.1109/icmtma.2009.352
File:
PDF, 373 KB
english, 2009