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[IEEE 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2015.10.21-2015.10.23)] 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Reliability behaviors of an exposed die FCCSP on a substrate with ultra-low CTE laminate material
Ren-Shin Cheng,, Chau-Jie Zhan,, Su-Yu Fun,, Su-Ching Chung,, Kuo-Chyuan Chen,, Yu-Lan Lu,, Chia-Wen Fan,, Tao-Chih Chang,Year:
2015
Language:
english
DOI:
10.1109/impact.2015.7365250
File:
PDF, 994 KB
english, 2015