Research on parametric analysis for stress of Plastic Ball...

International Journal of Materials and Product Technology 2008 Vol. 31; Iss. 2/3/4

Research on parametric analysis for stress of Plastic Ball Grid Array solder joint under shock load

Ping, Yang, Jie, Zhang, Dongyang, Wu, Binghao, Bao
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Volume:
31
Year:
2008
Language:
english
Journal:
International Journal of Materials and Product Technology
DOI:
10.1504/ijmpt.2008.018027
File:
PDF, 790 KB
english, 2008
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