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Strategies for improving the reliability of solder joints on power semiconductor devices
Lu, Guo‐Quan, Liu, Xingsheng, Wen, Sihua, Noel Calata, Jesus, Bai, John G.Volume:
16
Language:
english
Journal:
Soldering & Surface Mount Technology
DOI:
10.1108/09540910410537309
Date:
August, 2004
File:
PDF, 839 KB
english, 2004