[IEEE 2009 IEEE International Conference on 3D System Integration (3DIC) - San Francisco, CA, USA (2009.09.28-2009.09.30)] 2009 IEEE International Conference on 3D System Integration - Modeling and evaluation for electrical characteristics of through-strata-vias (TSVS) in three-dimensional integration
Xu, Zheng, Beece, Adam, Rose, Kenneth, Zhang, Tong, Lu, Jian-QiangYear:
2009
Language:
english
DOI:
10.1109/3dic.2009.5306543
File:
PDF, 1.11 MB
english, 2009