[IEEE 2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) - Cannes, France (2014.4.1-2014.4.4)] 2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) - Reliability characterization of a soot particle sensor: Analysis of stress- and electromigration in thin-film platinum

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