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[IEEE 2004 54th Electronic Components and Technology Conference - Las Vegas, NV, USA (1-4 June 2004)] 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546) - Stencil printing on bumped wafer for pre-applied underfill application
Hao Tang,, Shi, G., Crane, L., Todd, M., Carson, G.Year:
2004
Language:
english
DOI:
10.1109/ectc.2004.1319425
File:
PDF, 627 KB
english, 2004