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[IEEE 2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Seoul, South Korea (2015.12.14-2015.12.16)] 2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - A novel packaging method of fully passive optical alignment for multi-chennel optical interconnection module
Lim, Kwon-Seob, Kang, Hyun Seo, Jang, Jae-HyungYear:
2015
Language:
english
DOI:
10.1109/edaps.2015.7383690
File:
PDF, 411 KB
english, 2015