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[IEEE 2006 International Conference on Electronic Materials and Packaging - Kowloon, China (2006.12.11-2006.12.14)] 2006 International Conference on Electronic Materials and Packaging - Effect of High Temperature Storage on Reliability of Sn-Ag-Cu Flip Chip Solder Bumps
Huang, Xingjia, Lee, S.W. Ricky, Li, Ming, Chen, William T.Year:
2006
Language:
english
DOI:
10.1109/emap.2006.4430604
File:
PDF, 2.01 MB
english, 2006