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[IEEE 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC) - Kyoto, Japan (2015.4.14-2015.4.17)] 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC) - Heat dissipation characterization and application of SiC power devices by transient thermal measurement
Endoh, Ryo, Watanabe, Junichi, Sugie, Ryuichi, Yamamoto, TakashiYear:
2015
Language:
english
DOI:
10.1109/icep-iaac.2015.7111125
File:
PDF, 1.13 MB
english, 2015