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Temperature prediction for system in package assembly during the reflow soldering process
Deng, Shang-Shiuan, Hwang, Sheng-Jye, Lee, Huei-HuangVolume:
98
Language:
english
Journal:
International Journal of Heat and Mass Transfer
DOI:
10.1016/j.ijheatmasstransfer.2016.03.008
Date:
July, 2016
File:
PDF, 4.67 MB
english, 2016