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Interfacial reaction of Ni3Sn4 intermetallic compound in Ni/SnAg solder/Ni system under thermomigration
Yang, Yi-Shan, Yang, Chia-Jung, Ouyang, Fan-YiVolume:
674
Language:
english
Journal:
Journal of Alloys and Compounds
DOI:
10.1016/j.jallcom.2016.03.020
Date:
July, 2016
File:
PDF, 2.57 MB
english, 2016