[IEEE 2014 IEEE 23rd Electrical Performance of Electronic Packaging and Systems (EPEPS) - Portland, OR, USA (2014.10.26-2014.10.29)] 2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems - Through silicon via (TSV) noise coupling effects on RF LC-VCO in 3D IC
Lim, Jaemin, Cho, Jonghyun, Lee, Manho, Jung, Daniel H., Choi, Sumin, Lee, Hyunsuk, Kim, Joungho, Kim, Hyungsoo, Kim, Yongju, Kim, YunsaingYear:
2014
Language:
english
DOI:
10.1109/epeps.2014.7103592
File:
PDF, 470 KB
english, 2014