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Direct Bonding of Aluminum to Alumina for Thermal Dissipation Purposes
Lin, Chun-Yu, Tuan, Wei-HsingVolume:
13
Language:
english
Journal:
International Journal of Applied Ceramic Technology
DOI:
10.1111/ijac.12419
Date:
January, 2016
File:
PDF, 863 KB
english, 2016