Enhancement of underfill encapsulants for flip‐chip...

Enhancement of underfill encapsulants for flip‐chip technology

Vincent, M.B., Wong, C.P.
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Volume:
11
Language:
english
Journal:
Soldering & Surface Mount Technology
DOI:
10.1108/09540919910293856
Date:
December, 1999
File:
PDF, 391 KB
english, 1999
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