Reflow ageing influences and wettability effects of immersion tin final finishes with lead‐free solder
Hetschel, Thomas, Wolter, Klaus‐Jürgen, Phillipp, FritzVolume:
35
Language:
english
Journal:
Circuit World
DOI:
10.1108/03056120910953303
Date:
May, 2009
File:
PDF, 287 KB
english, 2009