Effect of PCB surface finish on creep properties of...

Soldering & Surface Mount Technology 2005 / 12 Vol. 17; Iss. 4

Effect of PCB surface finish on creep properties of lead‐free solder joints

Sundelin, Janne J., Nurmi, Sami T., Lepistö, Toivo K., Ristolainen, Eero O.
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Volume:
17
Language:
english
Journal:
Soldering & Surface Mount Technology
DOI:
10.1108/09540910510630377
Date:
December, 2005
File:
PDF, 314 KB
english, 2005
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