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[IEEE 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis - Shanghai, China (2005.6.27-2005.6.27)] 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis - A Novel Digital Signal Interface Design Used in OLED-On-Silicon
Zhang-jin, Chen, Feng, Ran, Mei-hua, Xu, Feng, Chen, Chao, LuYear:
2006
Language:
english
DOI:
10.1109/hdp.2005.251465
File:
PDF, 106 KB
english, 2006