“System in package technology” – design for manufacture...

Circuit World 2007 / 02 Vol. 33; Iss. 1

“System in package technology” – design for manufacture challenges

Richardson, Andrew, Bailey, Chris, Marc Yanou, Jean, Dumas, Norbert, Liu, Dongsheng, Stoyanov, Stoyan, Strusevich, Nadia
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Volume:
33
Language:
english
Journal:
Circuit World
DOI:
10.1108/03056120710723706
Date:
February, 2007
File:
PDF, 526 KB
english, 2007
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