Process characterization of PCB assembly using 0201...

Soldering & Surface Mount Technology 2003 / 08 Vol. 15; Iss. 2

Process characterization of PCB assembly using 0201 packages with lead‐free solder

Geiger, David, Mattsson, Fredrik, Shangguan, Dongkai, Ong, MT, Wong, Patrick, Wang, Mei, Castello, Todd, Yi, Sammy
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
15
Language:
english
Journal:
Soldering & Surface Mount Technology
DOI:
10.1108/09540910310479495
Date:
August, 2003
File:
PDF, 363 KB
english, 2003
Conversion to is in progress
Conversion to is failed