Aspects of advanced thermal management for flip chip on low...

Soldering & Surface Mount Technology 2009 / 04 Vol. 21; Iss. 2

Aspects of advanced thermal management for flip chip on low temperature cofired ceramics (LTCC)

Liu, Johan, Norén, M., Brunner, S., Hoffmann, C., Salz, W., Aichholzer, K.
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Volume:
21
Language:
english
Journal:
Soldering & Surface Mount Technology
DOI:
10.1108/09540910910947444
Date:
April, 2009
File:
PDF, 409 KB
english, 2009
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