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[IEEE 2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) - Cannes, France (2014.4.1-2014.4.4)] 2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) - The robustness of an algorithm applied in wafer-level material property extraction
Chuang, Wan-Chun, Lin, Yu-RuYear:
2014
Language:
english
DOI:
10.1109/dtip.2014.7056634
File:
PDF, 287 KB
english, 2014