[IEEE 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) - Singapore (2015.12.2-2015.12.4)] 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) - Analysis of ENEPIG bond pad peel-off after wire bonding
Khoong, Ling Eng, Gan, Tai KweeYear:
2015
Language:
english
DOI:
10.1109/eptc.2015.7412315
File:
PDF, 979 KB
english, 2015