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[IEEE 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) - Singapore (2015.12.2-2015.12.4)] 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) - Compact thermal modelling of packages containing multiple devices
Torzewicz, Tomasz, Czerwoniec, Andrzej, Janicki, Marcin, Napieralski, AndrzejYear:
2015
Language:
english
DOI:
10.1109/eptc.2015.7412322
File:
PDF, 291 KB
english, 2015