![](/img/cover-not-exists.png)
[IEEE 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) - Singapore (2015.12.2-2015.12.4)] 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) - Study of barrier layer thickness effect for the micro-bump
Li, H.Y., Jaafar, Norhanani Binte, Sam, Mohamad Iskandar B Es, Shee, Kalyn Lim Tien, Yin, Wong Lai, Jien, Chui KingYear:
2015
Language:
english
DOI:
10.1109/eptc.2015.7412328
File:
PDF, 2.06 MB
english, 2015