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[IEEE 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) - Singapore (2015.12.2-2015.12.4)] 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) - Characterization of hybrid underfill for low-temperature process applicable to flexible substrate
Son, Jihye, Eom, Yong-sung, Choi, Kwang-seong, Lee, Haksun, Bae, Hyun-cheol, Lee, Jin-hoYear:
2015
Language:
english
DOI:
10.1109/eptc.2015.7412366
File:
PDF, 1.29 MB
english, 2015