[IEEE 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) - Singapore (2015.12.2-2015.12.4)] 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) - Impact of mold compound on reliability performance in roughened Ni/Pd/Au-Ag preplated leadframe package
Li, Wu-Hu, Yong, Khai Seen, Acuesta, Albert, Schredl, JuergenYear:
2015
Language:
english
DOI:
10.1109/eptc.2015.7412428
File:
PDF, 589 KB
english, 2015