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[IEEE 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) - Grenoble, France (2015.5.18-2015.5.21)] 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) - Direct copper electrodeposition on novel CoMo diffusion barrier
Wang, Xu, Cao, Li-Ao, Qu, Xin-PingYear:
2015
DOI:
10.1109/iitc-mam.2015.7325637
File:
PDF, 1.38 MB
2015