[IEEE 2016 IEEE International Solid-State Circuits Conference (ISSCC) - San Francisco, CA, USA (2016.1.31-2016.2.4)] 2016 IEEE International Solid-State Circuits Conference (ISSCC) - 18.3 A 1.2V 64Gb 8-channel 256GB/s HBM DRAM with peripheral-base-die architecture and small-swing technique on heavy load interface
Lee, Jong Chern, Kim, Jihwan, Kim, Kyung Whan, Ku, Young Jun, Kim, Dae Suk, Jeong, Chunseok, Yun, Tae Sik, Kim, Hongjung, Cho, Ho Sung, Kim, Yeon Ok, Kim, Jae Hwan, Kim, Jin Ho, Oh, Sangmuk, Lee, HyunYear:
2016
Language:
english
DOI:
10.1109/isscc.2016.7418035
File:
PDF, 2.74 MB
english, 2016