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[IEEE 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) - Singapore (2015.12.2-2015.12.4)] 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) - Development of SiC power module using 70μm single metal layer substrates
Yuan, Hwang How, Jaafar, Norhanani, Dexter Velez, Sorono, Bum, Lee Jong, Wei, Yeap Yean, Woo, Daniel Rhee MinYear:
2015
Language:
english
DOI:
10.1109/eptc.2015.7412299
File:
PDF, 964 KB
english, 2015