The Effect of Grain Size and Film Thickness on the Thermal...

Journal of Nanoscience and Nanotechnology 2011 / 02 Vol. 11; Iss. 2

The Effect of Grain Size and Film Thickness on the Thermal Expansion Coefficient of Copper Thin Films

Hwang, Seulgi, Kim, Youngman
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Volume:
11
Language:
english
Journal:
Journal of Nanoscience and Nanotechnology
DOI:
10.1166/jnn.2011.3365
Date:
February, 2011
File:
PDF, 1.85 MB
english, 2011
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