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Using silica nanoparticles as curing reagents for epoxy resins to form epoxy–silica nanocomposites
Ying-Ling Liu, Shu-Hsien LiVolume:
95
Year:
2005
Language:
english
Pages:
9
DOI:
10.1002/app.21327
File:
PDF, 357 KB
english, 2005