[IEEE 2015 IEEE Electrical Design of Advanced Packaging and...

  • Main
  • [IEEE 2015 IEEE Electrical Design of...

[IEEE 2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Seoul, South Korea (2015.12.14-2015.12.16)] 2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Post-fabricated EBG tape on electronic devices for RFI mitigation in WLAN bands

Hsu, Wen-Yi, Shen, Chi-Kai, Wu, Tzong-Lin, Chen, Chung-Hao, Han, Dong-Ho
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Year:
2015
Language:
english
DOI:
10.1109/edaps.2015.7383711
File:
PDF, 494 KB
english, 2015
Conversion to is in progress
Conversion to is failed