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[IEEE 2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Seoul, South Korea (2015.12.14-2015.12.16)] 2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Post-fabricated EBG tape on electronic devices for RFI mitigation in WLAN bands
Hsu, Wen-Yi, Shen, Chi-Kai, Wu, Tzong-Lin, Chen, Chung-Hao, Han, Dong-HoYear:
2015
Language:
english
DOI:
10.1109/edaps.2015.7383711
File:
PDF, 494 KB
english, 2015