![](/img/cover-not-exists.png)
[IEEE 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) - Singapore (2015.12.2-2015.12.4)] 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) - Cu-Cu bonding by Ag nanostructure at low temperature of 180 °C
Liu, Ziyu, Wang, Qian, Cai, Jian, Zou, Guisheng, Liu, Lei, Shen, Daozhi, Tan, LinYear:
2015
Language:
english
DOI:
10.1109/eptc.2015.7412274
File:
PDF, 1.20 MB
english, 2015