Investigation of the Thermal Drift of MEMS Capacitive...

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IEEE Transactions on Components Packaging and Manufacturing Technology 2016

Investigation of the Thermal Drift of MEMS Capacitive Accelerometers Induced by the Overflow of Die Attachment Adhesive

Peng, Peng, Zhou, Wu, Yu, Huijun, Peng, Bei, Qu, Hao, He, Xiaoping
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Year:
2016
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/tcpmt.2016.2521934
File:
PDF, 2.73 MB
english, 2016
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