Electrothermal Cosimulation of 3-D Carbon-Based...

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IEEE Transactions on Components Packaging and Manufacturing Technology 2016

Electrothermal Cosimulation of 3-D Carbon-Based Heterogeneous Interconnects

Li, Na, Mao, Junfa, Zhao, Wen-Sheng, Tang, Min, Chen, Wenchao, Yin, Wen-Yan
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Year:
2016
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/tcpmt.2016.2538298
File:
PDF, 2.52 MB
english, 2016
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